Rigid flex PCB and rigid PCB assembly method comparison

The ignore assembly cost of the rigid flex PCB board

• Posted on 27 Jul 2016
• By Emma
• In Blog

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We have discussed the right way calculated rigid flex PCB assembly, this post is related to this topic.

Rigid flex PCB and rigid PCB assembly method comparison

In rigid flex PCB assembly solution just require one assembly step.
But if use cables assembly on rigid PCB board, there were two or more steps to be assembly.

The ignore cost during rigid flex PCB assembly

If you just consider the price from rigid PCB supplier, you may speed more money to assemble you rigid PCB project.
What is the extra ignore cost during rigid flex PCB order?
Emma has asked this question to experience PCB experts, and get the answer below.
The ignore cost during rigid flex PCB assembly must include items such as: the cost of kitting for assembly, labor, in-process inspection, cable assembly, test, final test, PCB tooling and test, and the costs associated with the engineering time required for each of these operations.

Source: http://4mcpcb.com/the-ignore-assembly-cost-of-the-rigid-flex-pcb-board.html

Top 5 common problems of repair multilayer PCB board

• Posted on 14 Jun 2016
• By David
• In Blog

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Three assembly method of multilayer PCB board

If you have assembly some electronic products, you will find more small, smart device to have more complex assembly methods.
Most modern multilayer PCB boards use Surface Mount Technology (SMT), through-hole components, or a combination to form a hybrid SMT-through-hole component board.

Electronic devices in our normal life become more and more complex

Most modern HDTVs, computers, Servers, CNC devices, etc use high tech multilayer PCB boards.
These multilayer PCB boards can can contain 50 layers or so of interwoven copper metal traces and fiberglass.
If you have learn some multilayer PCB board, you may know it’s were diffcult to repair multilayer PCB board.

The theory of how to repair multilayer PCB boards

If you have learned some multilayer PCB manufacturer process, you may understand this part very easy.
The copper foil traces are connected using vials and blind vials which are embedded in the PCB board itself.
The villas are built up layer by layer using additive electroplating and or electroless plating systems.
Copper metal traces and pads are etched onto the surface of the board.
Once the etching, electroplating, and cleaning processes are finished a UV curable solder mask is then applied to the substrate or PCB surface.

Top 5 common problems of repair multilayer PCB board

 

• Burnt PCB Traces
• Burnt Components
• Burnt PCB boards
• Micro-crystalline fractures within RoHS compliant, solder joints (common on CPU’s and GPU’s)
• Tin whiskers and gold whiskers

 

These boards can be repaired even when damage has occurred. PCB board failure can manifest itself in many different ways. Here are just a few.

Source: http://4mcpcb.com/top-5-common-problems-of-repair-multilayer-pcb-board.html

The risk of high temperature circuit board application

Top three features of high heat circuit board

This paper is going to discuss the high heat circuit board.
As we know the high heat circuit board is a high end PCB board type.
The designers have squeezed ever more performance out of printed circuit board.
This means that high heat circuit board designers should consider high temperature applications in the first.
If you have know electronic theory, you may find this is difficult to finish.
So we will from some different factors to discuss the feature of the high heat circuit board.

The risk of high temperature circuit board application

As we know power densities can affect the product temperature.
Then the power densities are on the rise, the temperature also rises.
HTD PCB manufacture experts told us that the risk of high temperature can wreak component.
Not only the havoc on the conductors, dielectrics, but also the circuit board itself.
As consequence of high temperature, you should consider more during the design process.

The electronic performance of high heat PCB board

We have known the high temperature can affect components.
This means the temperature also affects thermal and electrical impedances.
During the elevated temperatures, those electronic impedances have bad performance.
Causing erratic system performance, until it outright fails.

High heat PCB have differences in thermal expansion rates

If you have learned some PCB manufacture process, you may know the thermal expansion is an important factor.
As well know it’s a measure of the tendency of a material to expand when heated and shrink when cooled.
Its can be cause cracking and connection failures during PCB assembly process.
Between conductor and dielectrics generate mechanical stress.
By the the highest temperature PCB boards are subject to cyclic heating and cooling.

Source: http://www.htdcircuits.com/top-three-features-of-high-heat-circuit-board.html

To measure a good PCB manufacturer

If you have experience in new products development, you may know the risk of a PCB manufacturing sourcing is really hard work.
This post we will discuss this topic.

To measure a good PCB manufacturer
You know, to measure a good PCB manufacturer have many factors.
But the customer references are the first factor.
Because you can from those cooperated customer to analysis.
What is the most hot sell PCB type and the PCB market share.

The time of PCB manufacturer customers’ reference
This issue may most PCB purchase want to know.
Under HTD circuits experience, this is often done by a supplier before extending credit.
The same process can serve the end customers well.

How can the risk of a PCB manufacturing sourcing decision be minimized? Mail to info@htdcircuits.com to learn more.

The smallest mechanical via related to SMT

Why HTDcircuits discuss the smallest mechanical via?
This paper is focus on the smallest mechanical via.
In fact we have announce our PCB manufacturing capability.
And we have mention the smallest drill size.
There were many customers ask questions about the smallest mechanical via HTD can be done.
So we have to discuss this topic.

The mechanical via that PCB manufacturer can be done
If they are true vias where the finished size is NOT of any consequence, we say, “Why not call them out as +.003” minus the entire hole size?”
At that point I tell them that we can drill smaller and require less signal pad and anti-pad size, which opens the customer up for some routing for these fine-pitch parts. While we are at it, let’s talk about pitch.
Many times, we are approached by customers talking about a specific pitch between mounts or pads, such as .4mm or .5mm pitch.
Understand that without a design to see the via image data, it is difficult for a fabricator to properly understand what pitch means to the customer.
The pitch is the distance from the center of a given entity to the center of an adjacent entity.

The smallest mechanical via related to SMT
This can mean different things based on pad/mount size. Let me give you an SMT pad as an example:
A .5mm pitch means .0197” between the centers of two BGA pads or surface mounts. This seems like a very reasonable distance, given today’s circuit board geometries.
However, what if the designed surface mount pad width is .015” wide? This would mean a .5mm pitch would leave only .0047” edge to edge between the mounts.
This gives you little or no room to route a trace between mounts at that width and pitch.
Clearly as the pitch between parts decreases based on today’s shrinking chip footprints, the associated surface mount or BGA pad widths need to decrease as well to be able to route even a .003” or .004” trace between them.What is the smallest mechanical via that most PCB manufacturers can be done? mail to info@htdcircuits.com for detail.

Consider warping scrapped during PCB manufacturing

The good PCB supplier has a good final inspection of flatness
If you have chosen a good PCB supplier, the quality guarantee is necessary.
Due to not every one PCB plant can provide 100% final flatness inspection.
Most important is that the bat warping can affect PCB performance.
That’s the reason why we should avoid this issue.
So this paper will focus discuss how China PCB manufacturer treatment the bat warping PCB issue?

Most PCB manufacturers Use the oven to bake bat warping
HTDcircuits experts told us that all warping PCB boards should take out.
Usually the worker will pick out those warping PCB into the oven.
Then the oven will be set back under pressure, and the temperature can be get 150 degrees Celsius.
The last step is cool the PCB board in nature under pressure.
The cooling step can use 3-6 hours finish.

Take roof-floor bat in PCB flatness Check
Then we should check those warping PCB boards after the oven process.
Difference PCB manufacturers have a difference final inspection method.
In HTDcircuits plant, take roof-floor bat in PCB flatness check.
Due to this PCB, check method can save part board.
Even some of the PCB board may be two to three times the baked pressures to leveling.

Consider warping scrapped during PCB manufacturing
Most of time the warping issue can handle.
And there were some special machine can be use warping PCB board.
Even those methods can help you handle most warping issue.
Also consider warping scrapped during PCB manufacturing.
If more involved with the technological measures to prevent warping of practice, not baked pressure also useless part board, can only be scrapped.

Source:http://www.htdcircuits.com/how-china-pcb-manufacturer-treatment-the-bat-warping-pcb-issue-.htmlHow China PCB manufacturer treatment the bat warping PCB issue? Mail to info@htdcircuits.com for additional questions.

The preparing for multilayer PCB manufacturing material

The aim of multilayer PCB manufacturing material preparing process
If you have know the stress of multilayer PCB laminated, you will understand the aim of multilayer PCB manufacturing material preparing process more clear.
Because the layer after pressing except stress is very important for its lifetime. This point may confuse by most new hands of PCB designer.
So HTD circuits want to more guys to know that better multilayer PCB manufacturing material preparing process, longer life time it is.
The preparing for multilayer PCB manufacturing material process is one step completely not omitted.

The first step of multilayer PCB manufacturing material preparing
Produce multilayer prototypes in complete take out after.
The multilayer PCB manufacturing material can through hot, cold, cut or milling off.
All those PCB manufacturing method should be flashing in the oven.
Because most of time the stress of the PCB manufacturing material have changed when the flash in the oven.

The second step of multilayer PCB manufacturing material preparing
We have know the stress of multilayer PCB manufacturing material will be changed when it flash in the oven.
But how to measure the stress or how to make the decision to finish preparing process?
From our decades PCB experts, flat baked 4 hours, 150 degrees Celsius to release the stress gradually in the plate and resin curing.
This is a very important step for multilayer PCB board.
Because this factor not only relate to its lifetime, but also affect its performance.

Use CFD simulate PCB thermal design

How to handle the thermal management during automotive PCB design?

 

Making sure that automotive electronics are reliable, safe, and properly designed begins at the component level. Heat must be addressed early in the design process for these goals to be achieved. The most important thermal resistance for heat, outside the IC package, is the PCB. Rich PCB manufacturing engineers use 3D computational fluid dynamics (CFD) to simulate and test a PCB’s thermal design. Modeling the main heat flow paths in detail is critical to ensure that generated heat in the component flows out to the ambient, either through convection, conduction, or radiation. Knowing the thermal junction resistance allows optimizing a design for more efficient and less costly heatsinks, materials, and ICs.

When building a model to use in simulation, different methods can be used to represent chip packages and PCBs. Chip packages are typically defined as four types. The simple cuboid is a lumped component with some material properties and a heat source applied to it. The 2-resistor model doesn’t include any thermal capacitance and is therefore not suitable for transient analysis of component temperatures. The Delphi model is comprised of several thermal resistances and capacitances and thus is more accurate and suitable for transient simulations. Finally, the detailed model is modeled explicitly and is the most accurate model; however, it also increases the simulation time and requirements for computing resources.

For the PCB, four detailing levels from simple to complex also are used in simulation: lumped approximation, individual layers’ representation, layers modeled with “patches,” and copper tracks and areas modeled in detail.

Top three ignore point during PCB manufacturing

Top three ignore point during PCB manufacturing
This paper HTD PCB manufacturing experts will introduce three misunderstand.
If you have any questions about those Top three ignore point during PCB manufacturing, please feel free to contact us.
Our PCB manufacturing experts will reply ASAP.

1. Engineering design: the PCB design should note:
A. interlayer half curing chips, such as shall be symmetrical arrangement six layer board, 1 ~ 2 and 5 ~ 6 layer thickness and half between the number of curing pieces shall be consistent, otherwise layer after pressing warps easily.
B. produce multilayer prototypes core board and half curing piece should use the same supplier”s products.
C. outer A face and side B circuit patterns should be as close to the area. If A surface for big copper surface, but B surface walked several thread only, this kind of printed circuit board after the etching is very easy to warp. If both sides of the line are far too big, can the area in dilute side add some independent grid, make the balance.
2. Before blanking baked board:
Copper clad material before baking plate (150 degrees Celsius, time 8 + 2 hours) purpose is to remove the moisture in the plate and also make the plank to fully cure within the resin, further eliminate plank of stress, which left to prevent plate wrpping is helpful. At present, many two-sided and produce multilayer prototypes still insist on next makings before or after baking plate this step. But there are some board factory exception, currently the PCB board of the time regulation also baking inconsistent from 4 to 10 hours, according to the production, the suggestion to the class of the PCB and client requirements to decide the warping degrees. Baked or cut makeup; after block after baking feeding, two methods are feasible Suggestions after cutting materials, baking plate. Lining board should also be baking plate.
3. Half curing slice of weft to:
Half cured by slice layer after pressing zonally shrinkage to and material and, as must distinguish the stack layer to and a zonally. Otherwise, layer after pressing is very easy to create the finished product, even add pressure plate wrpping baking plate also hard to correct. Produce multilayer prototypes of reasons, many warping is laminated half curing chips when pyrocondensation, disorderly diego to didn”t distinguish caused by the release.
How to distinguish jinwei to? Volumes of half cured by the direction of tablet is up to, and width direction is a zonally; It long sides of copper foil board zonally, when the shorter edges is to cannot be determined by, such as producer or supplier to query.

HTD Group explain Gold Finger PCB technology

HTD Group is professional gold finger PCB manufacturer from China.
This paper will discuss gold plate technology.
If you want to learn more, please mail to info@htdcircuits.com

Gold contact surfaces are often used on circuit boards with membrane switches which are a technology of choice for industrial, commercial and consumer products. When PCBs will be repeatedly installed and removed electroplated gold is used for edge-connector contacts or as they are more commonly known: Gold fingers.
It is difficult to hear the term Gold finger without remembering the villain Auric Goldfinger from the James Bond film of 1964.
However, the gold fingers (gold-plated contact pins) found on PCBs are quite unlike Auric’s stubby, fat digits.
To begin with, the plating thickness of a PCB gold finger is typically a mere 300 micro-inch. At this thickness the hard gold is expected to survive 1,000 cycles before wear through.