HTD experts: Rigid-flex PCB designs guidle for wearable medical devices

The vast majority of PCBs in the world today are basically rigid plates to connect circuitry. But, that is changing rapidly; the demand for flexible PCBs (or flexible circuits) is rapidly increasing thanks in large part to the burgeoning wearable device market. Perhaps the largest segment of that market is the healthcare industry where wearable devices will be used to collect all varieties of physiological data for diagnosis and study, as well as personal health use. Already wearables are available to monitor heart rate, blood pressure, glucose, ECG, muscle movement, and more.

Those wearable devices present a number of difficulties for PCB manufacturer designers that rigid boards do not. Here are some of those problems and what designers can do to alleviate them.

Three-dimensional Design

While every PCB is actually three-dimensional, flexible circuits allow the entire assembly to be bent and folded to conform to the package that the product occupies. A typical assembly is shown in Figure 1. The flexible circuitry is folded so that the rigid PCBs fit in the product package, occupying minimal space.

In a typical rigid-flex design, the components mount on rigid boards, which are interconnected by flexible circuits. The flex circuits can be bent to install the assembly into the cabinet or case.

There is a lot more to the design, hence the additional challenges, than just connecting the rigid boards. Bends must be precisely designed so boards line up where they are intended to mount, while not putting stress on the connection points. Up until recently, engineers actually used “paper doll” models to simulate the PCB assembly. Now, design tools are available that provide 3D modelling of the rigid-flex assembly, allowing quicker design and much greater accuracy.

Small Products and Dense Circuitry

By definition, wearable products must be small and unobtrusive. In the past, a medical “wearable” such as a Holter monitor included a fairly large external device with a neck strap or belt mount. The new wearables are small and attach directly to the patient with no or few external wires. They collect a variety of data and can even process some analyses.

An unobtrusive device attaching directly to the patient dictates flex circuitry and very dense layouts. In addition, the board shapes are often circular or even more unusual shapes, calling for clever placement and routing. For such small and densely-packed boards, a PCB tool that is optimized for rigid-flex designs makes handling odd shapes much easier.

Careful with the Bend

The point of using flexible circuitry is to be able to shape the final assembly by bending the flex. This presents a number of problems that are not encountered on rigid boards. Bending produces stresses that do not occur with rigid boards.  Most PCB tools have tools that allow you to optimize the flex circuitry. To avoid problems with bending forces, here are four tips when design flex:

Don’t use 90° bends on traces: The corners of traces endure more bending stress than straight paths. To avoid delamination problems over time, use straight paths or if traces must change direction, use curves or piecewise-linear curves rather than anything approaching 90°.

Stagger traces on double-sided flex: when traces are run on top of each other on double-sided flex circuits causes uneven distribution of the tension. Instead, traces should be staggered. This also improves the flexibility.

Use teardrops to improve strength and yield: The flexibility of the substrate can lead to delamination over time if not controlled. Instead of circular pads, teardrop pads can be used to add additional material, providing greater strength to the pad to prevent delamination. The teardrops also provide greater tolerance for drilling.

Support your pads: The copper on a flexible substrate is more likely to detach than on a rigid board because of the bending. In addition, the adhesion of copper to the substrate is not as good as on an FR4 PCB. Fabricators suggest through-hole plating and anchor stubs for SMT mounting pads. They also suggest reducing coverlay openings as much as possible.

Stackup Design is Critical

The stackup — the map of the PCB layers — is critical when using rigid-flex techniques. Ideally, your PCB design software has the capability to design your stackup including both the rigid and flexible parts of the assembly. As mentioned earlier, the layout of the bending area should be designed to minimize the stresses on the traces and pads.

Figure 2 shows a stackup illustration with both rigid and flexible sections. The number of layers and different materials used adds to the complexity of the design. Therefore, it is important to design the stackup carefully and use a tool that can handle the entire flex and rigid assemblies.

Figure 2: This stackup design shows rigid PCBs on either end, connected by a two-layer flexible circuit.

Manufacturing

One of the biggest challenges with rigid-flex designs is qualifying multiple manufacturers. After the design is completed, all aspects of the design must be communicated to the board fabricator so that it will be properly manufactured. However, the best practice is to choose one or more manufacturers early in the design and collaborate with them to ensure your design matches their fabrication requirements as the design progresses. Collaborating with fabricators is simplified by using standards. In this case, IPC-2223 is the vehicle for communicating with your fabricators.

Once the design is complete, the data package must be assembled to hand-off to be manufactured. While Gerber is still used for standard PCBs in some companies, when it comes to the complexities of rigid-flex, it is highly recommended by both PCB software tool vendors as well as fabricators that a more intelligent data exchange format be used. The two most popular intelligent formats are ODG++ (version 7 or later) and IPC-2581, both of which clearly specify layer requirements.

Summing it Up

The vast majority of PCBs in the world today are basically rigid plates to connect circuitry. The vast majority of the human body is flexible and in motion. Mixing the two creates challenges that can only be solved with rigid-flex PCB designs.

Moving to flexible circuitry opens up a set of challenges beyond those for rigid boards. Care must be taken with stackup design, trace designs on the flexible substrates, and 3D bending. Then, more care must be taken in selecting, collaborating with, and supplying design data to the board fabricator.

The best way to ensure that your rigid-flex design works correctly and is delivered on-time and on-budget is to employ leading-edge PCB design software and take advantage of the automation features.

HTD Circuits Launches New Range of Rigid PCBs

Beijing: Leading PCB makers HTD circuits has announced a new range of Rigid PCBs. According to the MD, the market for rigid PCB is expanding fast and high-end manufacturers have to offer the best product that satisfies all parameters.

According to the MD, manufacturing of PCBs involves complex processes and is dependent on the hi-tech processes. End-user industries are looking for smart suppliers who can balance cost efficiency and energy efficiency.

From design to manufacturing and after sales support, HTD Circuits have a highly customer centric approach with all processes highly automated.

He said the electronic schematic of the circuit has been designed by the Computer Aided Design (CAD) software and the prototypes are planned with Computer Aided Manufacturing (CAM) software used by engineers to produce the PCB prototype.

After the PCB prototype is designed, the material of the printed circuit board is decided among the different PCB materials.

They can be one of the following –Alumina, Arlon, Bakelite, CEM1, CEM5, Ceramic, FR1, FR4, FR4 High Temperature, GeTek, Nelco, Polyimide, and Rogers.

After the material is selected, a coating of copper is applied to the entire board and the circuit layout will be printed on the board using a photosensitive process. The photo engraving process will be used as part of the circuit layout and result copper creates traces of the PCB circuit.

A mechanical milling process is used in connecting CNC machines to remove the unnecessary copper. The etch-resistant, silkscreen, printing process covers regions where traces exist.

During PCB fabrication, the PCB board will have copper traces without circuit components. For mounting components, holes are drilled at the points where the electrical and electronics parts are placed. The hole—drilling is done by lasers or special drills made of Tungsten Carbide. After holes are drilled, hollow rivets are inserted by an electroplating process creating an electrical connection between the layers.

The MD said the rigid PCBs will be in three types— single-layer, double-layer and multilayer PCBs. The double-layer PCBs have been made with complex circuits and doubled areas for conductor patterns.

Better innovation is achieved in ‘vias’, which are electrical ‘bridges’ functioning as holes filled with metals that conduct to all sides. International standards are maintained in the designing and manufacturing of new PCB series.

Quality levels of materials are in a constant update by stringent testing. The new PCBs will service end user industries like Telecommunication, Consumer Electronics, Automation Industries, Home Security, Automobiles, Computer Applications and Lighting industry.
Soure: http://www.htdcircuits.com/htd-circuits-launches-new-range-of-rigid-pcbs.html

Do you really know the HDI PCB board?

In the massive market of PCBs, the newly emerged hi-tech variant is High-Density Interconnector, with claims of a higher wiring density in per unit area compared to traditional PCBs.
What makes them hi-tech are fine lines, spaces, smaller vias and capture pads with higher connection pad density. The HDI PCB with its reduced size and weight enhances electrical performance of the device.
They have Micro via and buried Vias with sequential lamination as the best alternative to high layer-count and expensive lamination.
The advantages with HDI PCB are small size, high speed, and high frequency. They have already invaded personal computers, portable computers, mobile phones and personal digital assistants as the core component.
Since 2006, HDI PCBs in notebooks are real trend setters.
The design and manufacturing of a printed circuit board (PCB) are most critical as far as the main circuit is concerned. With rising speeds and shrinking printed circuit board geometries, high density interconnect (HDI) are becoming commonplace PCBs.
But there is a mistake of people treating HDI and micro vias as just another hole in the board focusing on ways to increase reliability while minimizing fabrication costs. By leveraging fine geometry technologies, companies can gain significant performance benefits without sacrificing reliability or high price premiums.
“If you tackle these boards like conventional multilayer boards, you’ll lose half the benefits. I’ll go into eight essential design elements used in HDI that is not part of through holes,” Holden said.
High-reliability and high layer count PCBs have applications on a range of cutting-edge ICT devices to social infrastructure and industrial equipment.
In PCBs, manufacturers specialize in different types of products such as flexible, rigid, flex-rigid.
As we know, flexible PCB manufacturer assembles circuits on a thin, flexible insulating material and allow PCB to bend and curve without damage to the circuit or insulating material.
They are used in medical equipment, flexible heaters, or even equipment such as hearing aids. The printed circuit board manufacturing can involve a vast range–from single layer to eight or more layers.
Depending on the complexity, PCBs can go from single to 42 layers in highly sophisticated circuitry. Different applications need different types of PCBs.
Rigid PCBs find use in consumer electronic items such as computers, televisions, mobile phones and so on.
But rigid PCBs when stretched beyond limits can crack or break. The rigid-flex variety is a combination of rigid and flexible PCBs and is used mostly in aerospace and military applications where dense circuits are the norm.

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