LED heat dissipation problem is LED manufacturers the most difficult problem, but can be used aluminum plates, because of the high thermal conductivity of aluminum PCB, heat, and can effectively export the internal heat. Aluminum plate is a unique metal-based CCL, with good thermal conductivity, electrical insulation properties and machinability. We should try to be close to the aluminum base PCB design, reducing the thermal resistance potting segment generated.
First, the characteristics of the aluminum plate
1. The use of surface mount technology (SMT);
2. In the circuit design is very effective for the thermal diffusion process;
3. Reduce product operating temperature, increase power density and reliability, extend the life of the product, the smaller footprint, lower hardware and assembly costs;
5. Replace the fragile ceramic substrates, for better mechanical durability.
Second, the structure of aluminum plate
Aluminum clad circuit board material is a metal, copper foil, thermal insulation layer and the metal substrate composition, its structure is divided into three layers:
Circuit layer (i.e. line layer): the equivalent of the common PCB laminates, foil thickness loz line to 10oz.
Dielectric layer (i.e. insulation layer): Insulation layer is a layer of thermal insulation materials with low thermal resistance.
Base layer : a metal substrate, usually aluminum or copper can be selected. Aluminum clad and traditional epoxy glass cloth laminated panels.
Circuit layers (i.e. the copper foil) are usually formed after etching printed circuits, so that each member elements interconnected, under normal circumstances, the circuit layer requires a great current carrying capacity, and thus should be thicker foil, thickness 35μm ~ 280μm; thermal insulation layer is aluminum plate where the core technology, it is generally a special polymer made of special ceramic-filled structure, small resistance, viscoelastic performance, thermal aging has the ability to withstand the mechanical and thermal stresses.
High performance aluminum plate using a thermal insulation layer is of such technology, it has very good thermal conductivity and high strength electrical insulation properties; metal substrate is aluminum plate support member, is required to have high thermal conductivity, typically aluminum can also be used copper (including copper can provide better thermal conductivity), suitable for drilling, punching and cutting other conventional machining. PCB material has advantages compared to other materials incomparable. SMT surface mount power components for public art. No radiator, much smaller, excellent heat dissipation, good insulation properties and mechanical properties.
Third, the use of aluminum plate:
Purpose: Power Hybrid IC (HIC).
1. Audio equipment: input, output amplifier, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.
2. Power Supply: switching regulator(DC/AC converter,SW regulator and the like).
3. Communication electronic equipment: high-frequency amplifier circuit transmitters(filtering appliances).
4. Office automation equipment: motor drives.
5. Automotive: Electronic ignition regulator(power controller).
6. Computer: CPU board(floppy disk drive power devices).
7. Power Modules: Inverters(solid relay rectifier bridges).
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